Dual-source magnetron sputtering system with independent DC and RF power for co-deposition, multilayer stacks, and metal-oxide thin film research. Configured by Virospuk for your process.
Advanced thin film research increasingly demands deposition of complex compositions — metal-oxide bilayers, alloy films with precisely controlled stoichiometry, graded interfaces, and multilayer stacks — all without exposing the substrate to atmosphere between deposition steps. A dual-target sputtering system with independent DC and RF power sources is the correct tool for these applications. Virospuk engineers will design the target arrangement, power schedule, and gas delivery sequence around your specific film architecture before system commissioning.
This dual-target magnetron sputtering coater houses two independent magnetron cathodes — one driven by a DC power supply for conductive metal targets, and one driven by a 13.56 MHz RF supply with automatic matching for insulating or ceramic targets. Both sources can operate simultaneously for co-deposition, or sequentially for clean multilayer deposition, with independent gas flow control per chamber zone.
| Parameter | Specification |
|---|---|
| Source 1 | DC magnetron — up to 500 W, conductive metal targets |
| Source 2 | RF magnetron — 13.56 MHz, up to 500 W, auto-matching, all target types |
| Power control | Independent — sources can operate simultaneously or sequentially |
| Target diameter | 2-inch per source (3-inch optional) |
| Chamber geometry | Confocal cathode arrangement — optimised for co-deposition uniformity |
| Sample stage | Motorised rotation, substrate heating up to 400 °C optional |
| Substrate size | Up to Ø 100 mm (4-inch wafer) |
| Ultimate base pressure | ≤ 5 × 10⁻⁶ mbar |
| Pumping system | Turbomolecular + rotary vane backing pump |
| Gas delivery | MFC-controlled Ar + reactive gas (O₂, N₂) lines |
| Control system | PLC touchscreen, multi-step recipe with inter-source interlocks |
| Power input | 220 V / 50 Hz — Indian standard |
| Certifications | CE compliant |
| Warranty | 12 months from commissioning |
With both sources active simultaneously and power ratio adjustable in real time, the dual-target system enables continuous composition grading across a film stack — for example, depositing a metal-rich base transitioning to a stoichiometric oxide surface in a single uninterrupted run. Sequential multilayer deposition (e.g. Cr adhesion layer followed by Au contact layer followed by SiO₂ passivation) can be fully automated through the recipe controller without breaking vacuum between layers.
Share your film architecture with our engineering team and we will design the deposition sequence and configure the system accordingly.
Your email address will not be published. Required fields are marked *
Please login to write review!
Looks like there are no reviews yet.
