Desktop DC Magnetron Sputtering Coater — Single Target
Depositing a reliable, reproducible metal thin film begins with the right process configuration — not just the right catalogue number. At Virospuk, we evaluate your substrate material, target composition, required film thickness, and base pressure requirements before recommending and configuring a DC magnetron sputtering system for your laboratory. The result is a system that arrives calibrated, process-ready, and supported by engineers who understand what you are trying to achieve.
This desktop DC magnetron sputtering coater is a compact, benchtop physical vapour deposition (PVD) system engineered for precision metal thin film deposition in research and development environments. Operating on the principle of DC magnetron sputtering, high-energy argon ions bombard a metallic target, ejecting atoms that travel through high vacuum and condense as a dense, adherent thin film on your substrate. The magnetron configuration traps electrons near the target surface, sustaining plasma at significantly lower pressures than conventional diode sputtering — delivering cleaner films with reduced substrate heating and faster deposition rates.
Where This System Is Used
Research groups across materials science, semiconductor device fabrication, MEMS, photovoltaics, and surface science rely on DC magnetron sputtering for reproducible deposition of conductive metal films. Typical use cases that Virospuk has engineered systems for include gold (Au) and chromium (Cr) contact deposition for organic electronic devices, titanium (Ti) adhesion layers for MEMS structures, aluminium (Al) back contacts for solar cells, and silver (Ag) films for plasmonic and optical research. The system is also extensively used for sputter-coating non-conductive SEM specimens with gold, platinum, or iridium to eliminate charging artefacts during electron microscopy.
Technical Specifications
| Parameter | Specification |
| Deposition technique | DC magnetron sputtering (Physical Vapour Deposition) |
| DC power supply | 150 W to 500 W (configuration dependent) |
| Target configuration | Single bottom target — reduced contamination, improved uniformity |
| Target diameter | 1-inch or 2-inch (specified at order) |
| Sample stage diameter | Ø 138 mm, motorised rotation for film uniformity |
| Ultimate base pressure | ≤ 1 × 10⁻⁵ Pa (≤ 1 × 10⁻⁷ mbar) |
| Pumping system | Turbomolecular pump + rotary vane backing pump |
| Process gas | Argon (Ar); reactive gas inlet via needle valve or MFC optional |
| Working pressure | 0.1 Pa to 2 Pa (typical sputtering range) |
| Substrate compatibility | Silicon wafers, glass, ITO glass, metal foils, polymer substrates |
| Max substrate diameter | Ø 138 mm |
| Control system | PLC touchscreen — programmable multi-step deposition recipes |
| Film thickness control | Time-based; crystal oscillator thickness monitor optional |
| Target cooling | Air-cooled (standard); water-cooled on 500 W model |
| Power input | 220 V / 50 Hz single phase — Indian standard, pre-configured |
| Footprint | Approximately 500 × 400 × 550 mm — benchtop installation |
| Certifications | CE, ISO compliant |
| Warranty | 12 months from date of commissioning at your facility |
Supported Target Materials
The DC power supply is compatible with all electrically conductive targets. Virospuk stocks and sources targets in the following materials: Gold (Au), Silver (Ag), Platinum (Pt), Aluminium (Al), Titanium (Ti), Chromium (Cr), Copper (Cu), Nickel (Ni), Molybdenum (Mo), Tungsten (W), Cobalt (Co), Indium (In), and binary alloys including NiCr, NiFe, TiW, and CrAu. Magnetic targets (Ni, Co, Fe) require an enhanced magnet pack — specify at enquiry stage.
The Virospuk Engineering Approach
Buying a sputtering coater from a catalogue is straightforward. Getting a sputtering process that works for your specific substrate, target material, and film specification is a different challenge entirely. Our process engineers will discuss your application in detail — target composition, required film thickness, acceptable surface roughness, substrate temperature constraints, and gas chemistry — before finalising the system configuration. We then handle import, customs clearance, installation, pump-down verification, first deposition run, and operator training at your facility. Every system is commissioned with a documented base pressure measurement and initial deposition trial before handover.
Typical Applications
- Metal contact and electrode deposition for semiconductor and organic electronic devices
- Gold and iridium conductive coating of non-conductive SEM specimens
- Chromium adhesion layers and gold pads for MEMS and microelectronic structures
- Titanium and aluminium thin films for photovoltaic device research
- Silver films for surface-enhanced Raman spectroscopy (SERS) substrates
- Platinum and palladium films for catalysis and electrochemical research
- Molybdenum back contacts for CIGS and CdTe solar cell research
- Barrier layer deposition (TiW, Cr) for diffusion prevention in multilayer stacks
Institutional Procurement and GST Compliance
Virospuk issues fully GST-compliant tax invoices suitable for institutional procurement through university purchase committees, DST and SERB project accounts, and DRDO procurement systems. All import duties, customs clearance, and inland logistics are handled by us — your purchase order is raised against Virospuk directly. INR pricing is fixed at order confirmation — no exposure to currency fluctuation between order and delivery.
To discuss your thin film deposition requirement and receive a process-matched system recommendation, contact our engineering team.