Programmable automated plasma sputter coater with DIP substrate transport and vacuum chuck — for controlled, repeatable thin film deposition on irregular and fragile substrates. Configured by Virospuk.
Standard benchtop sputtering coaters require the operator to manually position and retrieve substrates, limiting throughput and reproducibility in environments where multiple samples must receive identical coating conditions. The programmable DIP plasma sputter film coater addresses this with a motorised DIP transport mechanism that introduces the substrate into the plasma zone at a precisely controlled rate, holds it for a defined dwell time, and retracts — all under automated recipe control. The integrated vacuum chuck secures substrates of any shape — irregular, curved, or fragile — without mechanical clamping that would damage delicate specimens.
| Parameter | Specification |
|---|---|
| Deposition technique | DC or RF plasma sputtering (configuration-dependent) |
| Target diameter | 2-inch |
| Substrate transport | Motorised DIP mechanism — programmable dip rate, dwell time, and retract rate |
| Substrate holder | Vacuum chuck — holds irregular, curved, and fragile substrates without mechanical clamps |
| Recipe control | PLC touchscreen — programmable power, gas, dip parameters; recipe storage memory |
| Ultimate base pressure | ≤ 1 × 10⁻⁵ Pa |
| Pumping system | Turbomolecular + rotary vane backing pump |
| Process gases | Ar, O₂, N₂ — MFC controlled |
| Power input | 220 V / 50 Hz — Indian standard |
| Certifications | CE compliant |
| Warranty | 12 months from commissioning |
Specify your substrate shape, coating material, and throughput requirement — Virospuk engineers will configure the DIP transport speed and vacuum chuck arrangement for your application.
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